Key Characteristics

1. High strength, flexible nitrile phenolic based thermosetting adhesive film.
2. Activatable through heat or solvent for versatile application.
3. Can be die-cut for precision in application.
4. Slight surface tack, enhancing ease of handling and use.
5. Option for heat crosslinking to reinforce bond strength.
6. Suitable for lower temperature lamination within the nitrile phenolic film range.

Recommended Applications

1. Splicing of glass fabric during PCB board manufacturing.
2. Applications requiring strong, permanent bonds.
3. Industries needing heat or solvent-activated adhesive solutions.
4. Processes requiring the flexibility and precision of die-cut bonding films.