3M Thermal Bonding Film 588 13 in x 60 yd 2 Rolls/Shipper
Flexible, 100 Percent Solids, Heat Activating Dry Film Adhesive is Composed of a Higher Ratio of Thermosetting Resins than 583 for High Internal Strength and Structural Type Bonds. It is composed of a higher ratio of thermosetting resins than 3M Scotch-Weld Bonding Film 583 for high internal strength and structural type bonds. The thicker caliper of this product makes it especially suitable for various splicing.
3M Thermal Bonding Film 588 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
3M Thermal Bonding Film 588 is a thicker version of the 3M Thermal Bonding Film 583. This hot melt film adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form and is a heat curing film.
Key Features
- Flexible
- Heat or solvent activation
- Can be die-cut
- Heat crosslinkable option
Product ID: 3M 588 UPC: 00-021200-43775-5, 00021200437755 Stock ID: 62-0037-4101-4, 62003741014
Units per Pallet : 50 Rolls
Harmonizing Code : 3506910000
ECCN : EAR99