Developed for structural bonding of metals, high-strength plastic laminates (epoxy and phenolic) and honeycomb sandwich assemblies. Features: Heat-curing film adhesive with 250 Degree F curing cycle. Bonds metal to metal and metal to honeycomb.
May be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding. Performs well with either perforated or non-perforated core. Requires no primer; however, where priming is desired it may be used with 3M primer EC-2320. Uncured, it has a moderate degree of residual tackiness permitting easy positioning during lay-up operations. Meets requirements of MIL-A-25463 Type 1 Class 2 and MMM-A-132 Type 1 Class 3 specifications. Offers excellent storage stability.