Key Characteristics

1. Effective bonding at 177°C (350°F) cure temperature.
2. High peel strength and durability under stress.
3. Storage at 4°C (40°F) to maintain optimal adhesive properties.
4. No tack, low flow characteristics for precise application.
5. Clear film formation on solid surfaces ensuring aesthetic quality.
6. Capable of forming a tough, flexible bond rapidly.

Uses and Applications

1. Ideal for structural bonding of metals and glass in electronics.
2. Suitable for applications requiring high shear, peel, and cleavage strengths.
3. Applicable in a wide range of temperatures, maintaining bond integrity.
4. Useful in industries requiring lightweight and high-strength bonding solutions.
5. Optimized for low-pressure bonding processes.