3M Thermally Conductive Adhesive Transfer Tape 9885
10.0 mil thermally conductive adhesive on 2.0 mil, polyester liner. For mounting thermoelectric cooling modules, bonding heat sinks to microprocessors, bonding TAB-mounted IC and power transistor to PCB, and power transistor to heat sink.
Key Characteristics
- High mechanical strength for reliable thermal conductivity.
- Improved surface wet-out, ensuring adherence to rough surfaces.
- Excellent shock performance, maintaining integrity under stress.
- Available in wider and longer rolls for diverse application needs.
- Halogen-free, making it environmentally friendly.
- Optimized for thin bonding applications.
- Efficient thermal transfer suitable for high heat-generating components.
- Best used with high surface energy substrates for optimal adhesion.
Applications and Benefits
- Connects heat-generating components to heat sinks or cooling devices.
- Facilitates efficient heat dissipation in electronic devices.
- Enhances performance and longevity of electronic components.
- Ideal for use in compact and high-performance electronics.
- Supports thermal management in a variety of industrial applications.
10.0 mil thermally conductive adhesive on 2.0 mil, polyester liner. For mounting thermoelectric cooling modules, bonding heat sinks to microprocessors, bonding TAB-mounted IC and power transistor to PCB, and power transistor to heat sink.
