Description
3M Wafer De-taping Tape 3305, 25 mm x 100 m
- Enables simple, low-stress, room temperature peeling of 3M
- Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.
Product ID: 3M 3305 UPC: 04-548623-42221-3, 04548623422213 Stock ID: JT-2000-8523-4, JT200085234, 7010321285
Product ID : 3305
Adhesive Type : Silicone
Backing (Carrier) Material : Polyester
Brand : 3M™
Overall Length (Imperial) : 109.361 yd
Overall Length (Metric) : 100 m
Overall Width (Imperial) : 2.165 in
Overall Width (Metric) : 25 mm
Product Color : Green
Units per Pallet : 40 Rolls
Units per Pallet : 1920 Rolls
Harmonizing Code : 3919102055
ECCN : EAR99