Description
Protektive Pak 47026 - Wescorp ESD Hi Temp Polyimide Tape, 1/4 in x 36 yd
Protektive Pak 47026 - Wescorp ESD Hi Temp Polyimide Tape, 1/4 in x 36 yd
- Removal leaves little or no residue
- Masking off PCBs for IR reflow ovens or wave soldering under 572°F (300°C) ~ 10 seconds
- Near zero voltage generation when tape removed from PCB (at 50% relative humidity)
- Near zero voltage generation when tape unrolled from roll (at 50% relative humidity)
- Low sloughing plastic core
- Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
- For best results, apply to board using a rubber roller
- 1.0 mil thick (0.0254 mm) polyimide film
- 1.4 mil thick (0.0356 mm) conductive polysiloxide adhesive
- Adhesive surface resistivity 10E3 to 10E4 ohms
- Max temperature 300°C (572°F), 10 seconds
- Lead-free RoHS compliant
Product ID: 47026
Size : 1/4 in x 36 yd
Thickness : 1.0 Mil (0.001" or 0.0254 mm)
Conductive Polysiloxide Adhesive : 1.4 mil thick (0.0014" or 0.0356 mm)
Adhesive Surface Resistivity : 10E3 to 10E4 ohms
Max Temperature : 260°C (500°F)
Size : 1/4 in x 36 yd
Thickness : 1.0 Mil (0.001" or 0.0254 mm)
Conductive Polysiloxide Adhesive : 1.4 mil thick (0.0014" or 0.0356 mm)
Adhesive Surface Resistivity : 10E3 to 10E4 ohms
Max Temperature : 260°C (500°F)